keyword :

SMB molding

Impedance (Ω) at 100MHz

RDC (mΩ)

IDC （A）

Height (mm)

TYPE

L (μH)

RDC (mΩ)

IDC (Irms) (A)

Height (mm)

Size (length*width)

Customized available

Complied with AEC-Q200 (for Vehicle)

Impedance (Z)

Rated Current

Height

Size (A*B)

Complied with AEC-Q200 (for Vehicle)

All common mode list?

JCB 201209C (0805)

Inquiry

View Picture	Add to	Product	View Picture	P/N	Imedance(Ω)	Test Frequency(MHz)	RDC(Ω) Max.	IDC(mA) Max.	EIA size	Package(pcs/reel)	Datasheet (.pdf)
		Multilayer Chip Beads		JCB 201209C-121	120±25%	100	0.25	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-221	220±25%	100	0.35	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-301	300±25%	100	0.40	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-601	600±25%	100	0.50	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-102	1000±25%	100	0.60	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-152	1500±25%	100	0.35	200	0805	4000
		Multilayer Chip Beads		JCB 201209C-202	2000±25%	100	0.50	500	0805	4000
		Multilayer Chip Beads		JCB 201209C-222	2200±25%	100	0.50	500	0805	4000
		Multilayer Chip Beads		JCB 201209C-302	3000±25%	100	0.70	200	0805	4000