keyword :

SMB molding

Impedance (Ω) at 100MHz

RDC (mΩ)

IDC （A）

Height (mm)

TYPE

L (μH)

RDC (mΩ)

IDC (Irms) (A)

Height (mm)

Size (length*width)

Customized available

Complied with AEC-Q200 (for Vehicle)

Impedance (Z)

Rated Current

Height

Size (A*B)

Complied with AEC-Q200 (for Vehicle)

All common mode list?

Multilayer Chip Inductors

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View Picture	Add to	Product	View Picture	press for detail	Inductance range (μH)	RDC range (mΩ)	Rated current range (mA)	Dimensions LWH	Feature	series spec. (.pdf)
		Multilayer Chip Inductor		JCI 1005 (0402) series	0.22 ~ 2.2	1,200 ~ 1,700	25 ~ 10	1.00.50.5	◆ JCI series provide an effective solution for dense packed PCB designs ◆ Excellent solderability and high heat resistance for either flow or reflow soldering ◆ Closed magnetic circuit avoids crosstalk
		Multilayer Chip Inductor		JCI 1608 (0603) series	0.047 ~ 10	300 ~ 1,850	50 ~ 3	1.60.80.8	◆ JCI series provide an effective solution for dense packed PCB designs ◆ Excellent solderability and high heat resistance for either flow or reflow soldering ◆ Closed magnetic circuit avoids crosstalk
		Multilayer Chip Inductor		JCI 2012 (0805) series	0.047 ~ 33	200 ~ 1,250	300 ~ 5	2.01.20.9~1.25	◆ JCI series provide an effective solution for dense packed PCB designs ◆ Excellent solderability and high heat resistance for either flow or reflow soldering ◆ Closed magnetic circuit avoids crosstalk
		Multilayer Chip Inductor		JCI 0603C (0201) series	0.001 ~ 0.027	140 ～ 1,800	470 ~ 120	0.60.30.3	◆ For miscellaneous high-frequency circuits ◆ EMI countermeasure in high-frequency circuits ◆ High SRF up to 6GHz and above
		Multilayer Chip Inductor		JCI 1005C (0402) series	0.001 ~ 0.12	100 ～ 1,600	300 ~ 150	1.00.50.5	◆ For miscellaneous high-frequency circuits ◆ EMI countermeasure in high-frequency circuits ◆ High SRF up to 6GHz and above