keyword :

SMB molding

Impedance (Ω) at 100MHz

RDC (mΩ)

IDC （A）

Height (mm)

TYPE

L (μH)

RDC (mΩ)

IDC (Irms) (A)

Height (mm)

Size (length*width)

Customized available

Complied with AEC-Q200 (for Vehicle)

Impedance (Z)

Rated Current

Height

Size (A*B)

Complied with AEC-Q200 (for Vehicle)

All common mode list?

JCB 201209 (0805)

JCB 201209

Application:
Consumer Electronics, Communications, Computer products, VCR, cameras and Noise suppression in digital equipment

Feature

More information

Shape and Dimensions

Related products

Inquiry

Product	P/N	Imedance(Ω)	Test Frequency(MHz)	RDC(Ω) Max.	IDC(mA) Max.	EIA size	Package(pcs/reel)
Multilayer Chip Beads	JCB 201209-110	11±25%	100	0.15	600	0805	4000
Multilayer Chip Beads	JCB 201209-320	32±25%	100	0.15	400	0805	4000
Multilayer Chip Beads	JCB 201209-800	80±25%	100	0.15	300	0805	4000
Multilayer Chip Beads	JCB 201209-151	150±25%	100	0.25	300	0805	4000
Multilayer Chip Beads	JCB 201209-121	120±25%	100	0.25	300	0805	4000
Multilayer Chip Beads	JCB 201209-221	220±25%	100	0.30	200	0805	4000
Multilayer Chip Beads	JCB 201209-301	300±25%	100	0.30	200	0805	4000
Multilayer Chip Beads	JCB 201209-501	500±25%	100	0.30	200	0805	4000
Multilayer Chip Beads	JCB 201209-601	600±25%	100	0.35	200	0805	4000
Multilayer Chip Beads	JCB 201209-102	1000±25%	100	0.45	200	0805	4000