keyword :

SMB molding

Impedance (Ω) at 100MHz

RDC (mΩ)

IDC （A）

Height (mm)

TYPE

L (μH)

RDC (mΩ)

IDC (Irms) (A)

Height (mm)

Size (length*width)

Customized available

Complied with AEC-Q200 (for Vehicle)

Impedance (Z)

Rated Current

Height

Size (A*B)

Complied with AEC-Q200 (for Vehicle)

All common mode list?

JLPI070705ST

JCI

JLPI070705ST

Application:
Industrial Electronics, Consumer Electronics, Internet of things, 5G application.

Feature

Low loss realized with low DCR .
High performance realized by metal dust core.
Ultra low buzz noise, due to composite construction.
100% Lead(Pb)-Free and RoHS compliant.

More information

Package of JLPI 070705ST.pdf

Shape and Dimensions

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